COMPEL - The international journal for computation and mathematics in electrical and electronic engineering: Volume 21 Issue 4

A current transformer modeling

Yann Le Floch, Christophe Guérin, Dominique Boudaud, Gérard Meunier, Xavier Brunotte

This paper presents the modeling of a current transformer by various methods with the FLUX3D software. The technique used is based on the finite element method coupled with…

Achieving the holy grail of seamless CAD data import into analysis software

J. Oakley, C.P. Riley, S. Taylor, C.W. Trowbridge

One of the difficulties in electromagnetic modelling has been the lack of standard CAD data to enable direct import of data into analysis software. Many solid modelling standards…

Application of regularisation method of quasi‐singular integrals to compute eddy current distribution near cracks

Philippe Beltrame, Noel Burais

For thin cracks, in eddy current testing (ECT), the field‐flaw interaction is equivalent to a current dipole layer on its surface. The dipole density is the solution of an…

Design of photonic band gap optical fibers using finite elements

S. Guenneau, S. Lasquellec, A. Nicolet, F. Zolla

In this paper, we study a new class of optical fibers to be utilized in future optics and optoelectronics. These so‐called photonic band gap (PBG) waveguides can be classified…

Analysis of techniques to compare complex data sets

D.E. Coleby, A.P. Duffy

This paper analyses a number of techniques that can be used to compare complex data sets, such as those arising from electromagnetic simulation and experimentation. The techniques…

3‐D eddy current computation for a transformer tank

Hiroshi Kanayama, Ryuji Shioya, Daisuke Tagami, Satoshi Matsumoto

A large scale computation of three‐dimensional eddy current problems is considered; their numbers of degrees of freedom are near one million. A parallel computing using the…

Integration of control loops in coupled field circuit model to study magnetic devices supplied by power electronic converter and their control

G. Manot, Y. Lefèvre, H. Piquet, F. Richardeau

In this paper, we present a method to take into account the feedback control in software developed from coupled field circuit models. The implementation of control loops is done…

Calculation of winding losses using matrix modeling of high frequency transformer

K.W.E. Cheng, K.F. Kwok, S.L. Ho, Y.L. Ho

Calculation of the winding losses of high frequency transformer based on one‐dimensional field analysis is normally inapplicable for complex winding configurations. This paper…

Eddy currents in thin plates modelled as surface regions

Virgiliu Fireteanu, Bernard Paya, Jacques Nuns, Tiberiu Tudorache

This paper analyses the conditions for which the results of eddy currents computation in thin regions modelled by surface regions are concordant with those obtained using volume…

Field and current flow analysis of the buried feeding line of the innovative electric transport concept STREAM

P. Alotto, F. Delfino, G. Molinari, M. Rossi, V. Siciliano, P.O. Ventura

STREAM is the acronym of a new concept of mass transit system designed and developed by Ansaldo Trasporti S.p.A. to provide an efficient solution to rubber‐tyred transportation…

Developments of an efficient global optimal design technique – a combined approach of MLS and SA algorithm

S.L. Ho, Shiyou Yang, Peihong Ni, H.C. Wong

A new response surface model (RSM), the moving least squares (MLS) approximation, is proposed for reconstructing the objective/constraint functions for the design optimization of…

Magnetic field around the aluminium electrolysis cells

Augustin Moraru, Aureliu Panaitescu, Ileana Panaitescu, Antoineta Soci

Two magnetostatic applications are reported, related to the magnetic field around the aluminium electrolysis cells. The first exhibits the magnetic field created by the current…

3D‐FDTD characterization of an original low‐loss silicon line

Alexandre Richardson, Laurent Cirio, Laurent Martoglio, Odile Picon

A numerical and experimental analysis of an original inverted microstrip transmission line on standard Silicon substrate for telecommunication applications is proposed…