An overview of the current status of lead‐free assembly and related issues

Abstract

Over the last few years, the emergence of new European draft legislation has focussed electronics industry attention on the likely ultimate proscription of lead in electronics assembly. Much work has already been undertaken to identify the possible alternatives to conventional tin‐lead solders and to evaluate their performance benefits and limitations in comparison with the traditional materials. Although, some companies are already offering products manufactured using lead‐free products, there is still a widespread lack of activity in many areas. With this none‐too‐distant deadline rapidly approaching, Envirowise has sponsored this paper as part of its coordinated activities to assist the UK electronics industry and to promote environmental efficiency and best practice. This paper details the current situation with respect to the drivers towards the adoption of lead‐free assembly before giving an overview of the current situation. This paper concludes with details of sources of further information.

Citation

Goosey, M. (2003), "An overview of the current status of lead‐free assembly and related issues", Circuit World, Vol. 29 No. 4, pp. 23-27. https://doi.org/10.1108/03056120310478541