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Thin‐film embedded resistor and capacitor technologies

Percy Chinoy (Shipley Co LLC, Marlborough, MA, USA)
Marc Langlois (Shipley Co LLC, Norcross, GA, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2004

644

Abstract

Printed circuit board designers face formidable challenges of increased functionality in smaller size boards, and reduced EMI in high‐speed circuits. Embedded passives technology can open up valuable space on the board surface while also improving the electrical performance and reliability of high density, high‐speed designs. Shipley has developed a thin‐film, high sheet resistivity (1,000 Ω/□) resistor material sold under the trade name InSite™ in response to this market need. This paper describes the manufacturing process for embedded resistors and discusses measured data on resistance values, uniformity, and thermal effects, and their impact on design rules for resistor size. Preliminary results of Shipley's thin‐film embedded capacitor technology with high capacitance densities (10 and 200 nF/cm2) are also presented.

Keywords

Citation

Chinoy, P. and Langlois, M. (2004), "Thin‐film embedded resistor and capacitor technologies", Circuit World, Vol. 30 No. 1, pp. 16-19. https://doi.org/10.1108/03056120410496333

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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