Lead‐free and No‐clean Soldering for Automotive Electronics*

Abstract

As the electronics industry moves towards the 21st century, environmentally conscious manufacturing is becoming a very important issue for the industry. In recent years, advanced manufacturing technologies have been developed for automotive electronics packing that not only are environmentally friendly, but also reduce manufacturing complexity and cost, improve product quality, and meet the stringent reliability requirements for the automotive environment. In this paper, aspects of no‐clean soldering and lead‐free solderr development are reviewed, and some of the most critical factors for implementing no‐clean soldering and for developing lead‐free solders for automotive electronics are outlined.

Citation

Shangguan, D. and Gao, G. (1997), "Lead‐free and No‐clean Soldering for Automotive Electronics*", Soldering & Surface Mount Technology, Vol. 9 No. 2, pp. 5-8. https://doi.org/10.1108/09540919710800665