Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices

Abstract

A new micromachining technology of mechanically fixed and thermally insulated cantilevers, bridges and islands was developed to be used for design of GaAs heterostructure based microelectromechanical systems (MEMS) devices. Based on the micromachining technology, two different MEMS devices were designed and analyzed. The first one was micromechanical thermal converter (MTC) and the second one was a micromechanical coplanar waveguide (MCPW). The basic electro‐thermal as well as microwave properties of the MEMS devices designed are investigated. The results obtained are also supported by simulation. The advantages of the fixed micromechanical structures in the field of design of new MEMS devices are discussed.

Citation

Lalinsky´, T., Haščík, S., Mozolová, Ž., Burian, E., Krnáč, M., Tomáška, M., Škriniarová, J., Drzˇík, M., Kosticˇ, I. and Matay, L. (2003), "Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices", Microelectronics International, Vol. 20 No. 1, pp. 43-47. https://doi.org/10.1108/13565360310455526