Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Abstract

Purpose

The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.

Design/methodology/approach

Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties.

Findings

The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices.

Originality/value

This paper shows the advantages of new technologies and materials in PCB thermal management.

Citation

Baszynski, M., Ramotowski, E., Ostaszewski, D., Klej, T., Wojcik, M., Kohvakka, M. and Kamari, A. (2016), "Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties", Circuit World, Vol. 42 No. 1, pp. 32-36. https://doi.org/10.1108/CW-10-2015-0054