Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques

Abstract

Purpose

The purpose of this study is to explore the synthesis of novel conductive photo-resins to produce flexible conducting composites for use in additive manufacturing. By using direct ink writing (DIW) additive manufacturing, this study aims to explore the fabrication of multimaterial devices with conductive and insulating components. Using digital light processing (DLP) additive manufacturing, this study aims to fabricate detailed objects with higher resolution than material extrusion 3D printing systems.

Design/methodology/approach

In this paper, several photocurable conducting resins were prepared for DIW and DLP additive manufacturing. These resins were then cured using 405 nm near UV light to create intrinsically conductive polymer (ICP) composites. The electrochemical properties of these composites were analysed, and the effect of co-monomer choice and crosslinking density was determined. These results determined a suitable resin for subsequent additive manufacture using DIW and DLP. These 3D printing techniques were used to develop flexible conducting devices of submillimetre resolution that were fabricated with unmodified, commercially available 3D printers.

Findings

Cyclic voltammetry and volume conductivity analysis of the conducting resins determined the most conductive resin formula for 3D printing. Conductive devices were fabricated using the two 3D printing techniques. A multimaterial soft conducting device was fabricated using DIW, and each conducting component was insulated from its neighbours. DLP was used to fabricate a soft conducting device with good XY resolution with a minimum feature size of 0.2 mm. All devices were prepared in unmodified commercially available 3D printers.

Practical implications

These findings have value in the development of soft robotics, artificial muscles and wearable sensors. In addition, this work highlights techniques for DIW and DLP additive manufacturing.

Originality/value

Several original conducting resin formulae were developed for use in two 3D printing systems. The resulting 3D-printed composites are soft and flexible while maintaining their conductive properties. These findings are of value to both polymer chemists and to the field of additive manufacturing.

Citation

Engel, K., Kilmartin, P.A. and Diegel, O. (2023), "Flexible and multi-material intrinsically conductive polymer devices fabricated via DLP and DIW additive manufacturing techniques", Rapid Prototyping Journal, Vol. 29 No. 10, pp. 2164-2175. https://doi.org/10.1108/RPJ-02-2023-0037