Electric current stressing enhanced damping properties in Sn5Sb solder
Abstract
Purpose
The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.
Design/methodology/approach
Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution.
Findings
It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current.
Originality/value
These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.
Keywords
Acknowledgements
This work was supported by the National Natural Science Foundation of China under Grant No. 52365042, Innovation Project of Guangxi Graduate Education Nos. YCSW2023318 and JGY2021084 and Innovation Project of GUET Graduate Education No. 2022YCXS007.
Citation
Liu, L., Chen, F. and Li, W. (2024), "Electric current stressing enhanced damping properties in Sn5Sb solder", Soldering & Surface Mount Technology, Vol. ahead-of-print No. ahead-of-print. https://doi.org/10.1108/SSMT-02-2024-0005
Publisher
:Emerald Publishing Limited
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