XYFLEX multi-head dispensing technology launched in Northern Europe

Citation

(1999), "XYFLEX multi-head dispensing technology launched in Northern Europe", Assembly Automation, Vol. 19 No. 2. https://doi.org/10.1108/aa.1999.03319baf.003

XYFLEX multi-head dispensing technology launched in Northern Europe

XYFLEX multi-head dispensing technology launched in Northern Europe

Keyword Electronics

CAM/ALOT Speedline Technologies announces the development of the fastest, most flexible liquid dispensing system on the market ­ three times faster than any other system. XYFLEX can dispense up to 140,000 dots per hour and is therefore able to keep up with chip shooters that place components at rates of 40,000-90,000pph. The system, which consists of four heads and up to eight pumps, is also able to dispense solder paste, adhesives, conductive epoxies, encapsulants, and flip chip underfill ­ at the same time ­ and at different programmable speeds to meet the needs of the application (see Plate 2).

XYFLEX was developed based on recommendations made by an advisory panel consisting of CAM/ALOT's core customers. As a result, it is the first dispenser that can be installed as an in-line system with the capability of meeting throughput requirements dictated by high volume pick-and-place machines.

Plate 2 Xyflex multi-head dispensing technology

It is also one of the most precise. At its maximum speed of 140,000dph placement accuracy is ±75 microns (±0.003") at 3 sigma. At 125,000dph, the news is even better: placement accuracy is ±50 microns (±0.002"), which is unsurpassed in the industry.

A unique feature of XYFLEX is the X axis drive train. There is none. Instead, positioning of the dispensing heads is accomplished by an innovative gantry system consisting of guide arms attached to Y axis ball slides at one end and a pivot point on the pump head at the other end. Movement of the ball slides in opposite directions along the Y axis lead screws causes movement along the X axis. Precision positioning is achieved with the use of linear and rotary encoders (three linear and two rotary per drive system) and closed loop servo motors.

Throughput is enhanced with a dual-lane conveyor system with eight independent zones. (A single lane conveyor is available as an option.) The dual lanes feature adjustable rails to accommodate either PCBs or Auer boats of different widths. Four pumps can be committed to each lane, and the pumps can dispense material on sections of a board or an entire board at one time, depending on how the machine is programmed. The maximum dispense area is 18" × 13". Both single and dual-lane conveyor systems are controlled with optical stop pins.

XYFLEX comes in two models: a surface mount version that is capable of dispensing solder paste, adhesives and conductiveepoxies, and a semiconductor version with four zones of contact heat for dispensing encapsulants and flip chip underfill. Additional features include a vision alignment system, automatic needle calibrator and Windows NT operating software. A newly designed computer platform incorporates a flip-up keyboard and tilting LCD panel and moves across the length of the system for ease of operator access.

For further information contact Peter Gibbs at Speedline Technologies, Unit 1, Pincents Kiln Industrial Park, Reading RG31 7SD, UK. Tel: +44 (0)118 930 1400; Fax: +44 (0)118 930 1401.