Assembléon introduces high-speed bare-die capability on versatile mid-volume component mounters

Citation

(2002), "Assembléon introduces high-speed bare-die capability on versatile mid-volume component mounters", Assembly Automation, Vol. 22 No. 4. https://doi.org/10.1108/aa.2002.03322dad.007

Assembléon introduces high-speed bare-die capability on versatile mid-volume component mounters

Assembléon introduces high-speed bare-die capability on versatile mid-volume component mounters

Keywords: Electronics assembly

Assembléon introduces a Wafer Feeder option for its Topaz-Xi^|| and ACM component placement machines. Representing an important breakthrough in medium-volume die placement for SMT and semiconductor industries, the new feeder enables manufacturers to bring wafer feeding on-line at lowest cost per placement.

Assembléon offers a unique solution with the flexibility for processing boards populated with both bare dies and conventional SMDs at minimal incremental cost and with high throughput. Implemented on the Topaz-Xj^||, the new feeder delivers bare-die placement speed of around 6300 cph with an accuracy of 20 micron at 1 sigma. The ACM with wafer feeder can place up to 3000 cph with an accuracy of 3 micron at 1 sigma. This combination of accuracy and speed is unmatched by any other mounter in the mid- volume market.

A number of feeder design elements contribute to this output advantage. Wafers are indexed at high speed. A sophisticated die push-up unit transfers the bare die from the wafer to the nozzle of the placement robot with less than 300 ms die-to-die cycle time and bad mark sensing. A wafer exchange time of 2 sec, and capacity for accommodating up to 20 wafers, ensures high-efficiency operation with little operator intervention.

Furthermore, the Wafer Feeder handles wafers from 5 to 8 in (configurable), and five toolbits cover a range of die sizes from 2.5 to 18.0 mm square and 0.07 to 0.5 mm thickness.

Assembléon’s Topaz-Xi^|| and ACM are both highly versatile machines placing a wide range of SMDs and odds with high precision. With up to four wafer feeders per machine, easily and quickly installed via a simple mechanical and electronic interface, high volume die placement is now easier than ever and inexpensive, lowering the total cost of production.

For further information contact Assembléon, Anique van Waardt, Corporate Branding Officer, Building BL116, PO Box 218, 5600 MD Eindhoven, The Netherlands. Tel: +31 40 27 23441; Fax: +31 40 27 24240; E-mail: Anique.van.Waardt@philips.com