Citation
Deng, T.J. (2010), "Guest editorial", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 29 No. 2. https://doi.org/10.1108/compel.2010.17429baa.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2010, Emerald Group Publishing Limited
Guest editorial
Article Type: Guest editorial From: COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering, Volume 29, Issue 2
The papers in this special issue of COMPEL: The International Journal for Computation and Mathematics in Electrical and Electronic Engineering are selected from papers presented at CAC2008 (The International Conference on Wireless Systems: Computation, Assembling, and Compatibility). The conference was technically sponsored by IEEE Local Chapters, and jointly organized and supported by the MII of China, PHEI, Emerald Group Publishing Ltd, three highly ranked universities (SCU, UESTC and SWJTU) in the west of China, and DTQ Group. The conference provided an international forum for the exchange of information on the state-of-the-art research and developments in areas of wireless technologies in terms of computation/design, assembly/fabrication, and integration/compatibility issues with relevance to both academic and industrial researchers.
It is with great pleasure that we introduce this special issue on computation, assembling, and compatibility. This special issue consists of 28 papers selected from over 300 conference papers covering a wide spectrum of techniques and applications encountered in the design and manufacture of today’s electronic systems. Authored by outstanding researchers, these papers cover both experimental and speculative topics. This special issue provides the reader with a timely account of state-of-the-art research on these topics. As with all special issues, the topics that we cover here are just highlights from the large volume of literature currently provided by the technical community.
As a Guest Editor, I would like to thank the following experts and colleagues who supported this activity and reviewed the selected papers:
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Raj Mittra, IEEE Fellow, Pennsylvania State University, USA.
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Amir Mortazawi, IEEE Fellow, University of Michigan, USA.
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Marek E. Bialkowski, IEEE Fellow, University of Queensland, Australia.
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Mark Montrose, IEEE Fellow, IEEE EMC Society, USA.
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Z.H. Shao, Futronic, Singapore.
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X.K. Kang, Motorola Asia, Singapore.
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S.Q. Yang, UESTC, China.
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J.P. Li, UESTC, China.
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S.W. Yang, UESTC, China.
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X.J. Huang, ComPro Software, USA.
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X.H. He, SCU, China.
We sincerely hope that this special issue will be a reference publication for future research. These papers cover topics that are timely and important, and the authors have done an excellent job of presenting the material. We extend our sincere thanks to all the authors and reviewers. Finally, special thanks are due to the editorial staff for editing and assembling this issue. Please feel free to contact us if you have technical questions or comments at: tqdeng@dtqgroup.com
TianQuan James DengGuest Editor