Ericsson, Shipley and PTC Holmstrands sign agreement to install electrodeposited resist technology

Citation

(1999), "Ericsson, Shipley and PTC Holmstrands sign agreement to install electrodeposited resist technology", Circuit World, Vol. 25 No. 2. https://doi.org/10.1108/cw.1999.21725bab.018

Ericsson, Shipley and PTC Holmstrands sign agreement to install electrodeposited resist technology

Europe

Ericsson, Shipley and PTC Holmstrands sign agreement to install electrodeposited resist technology

Keywords Ericsson, Holmstrands, PTC, Shipley

At the EPC Convention in Wiesbaden, Germany, Ericsson Radio Systems PC Technology Centre in Kumla, Sweden, signed an agreement with Shipley Company to use Shipley's PEPR 2400 electrodeposited resist system, applied using PTC Holmstrands processing equipment. The process will be used to build next generation printed circuit boards for mobile telephones, using sequential build-up technology.

With installation due in May 1999, PTC Holmstrands, Shipley and Ericsson are working together intensively on the project. "The PEPR process is unique", explains Ingvar Rydh, managing director of Shipley Svenska AB. "Electrodeposited resists provide enhanced resolution capability for fine features, conformance to the non-planar surfaces seen in buildup technology, and the protection of 3D features.

Ericsson selected the PEPR process for its fine line capability, delivering 50 micron lines and spaces, its ability to protect in three dimensions, and its suitability for sequential build-up products. In addition, its ability to produce landless vias to increase functionality per unit area was a decisive factor. PEPR is capable of coating and protecting holes in both outerlayers and innerlayers, and is particularly suited to buried and blind via manufacture.

The combination of equipment and chemistry is key to achieving optimum yields, and the design of the PTC Holmstrands modules gives maximum flexibility in operations. Shipley will provide full technical support and training, and we look forward to working with Ericsson in implementing this advanced technology."

The equipment used will be a Modumatic ED line manufactured by PTC Holmstrands, based in Vålberg, Sweden. The vertical mode electrodeposited resist application line has a capacity of up to 150 panels per hour. Developed over several years, the ED Modumatic is the only known vertical plating machine designed specifically for the ED process.

With an overall length of 16 metres including automatic loading and unloading stations, the machine incorporates cleaning and ED resist application tanks, tunnel drying and cooling, and PC control systems with dedicated software. All process changes are carried out using the PC and operator information is presented in both English and Swedish. System timings can be set to allow precise synchronisation of desired treatment times in each process stage. Total panel cycle time including transportation is approximately 55 minutes.

The machine is entirely enclosed, with UV protection to doors and filter units providing clean-room conditions, thus avoiding the need for costly investment in a dedicated clean room. Vertical transportation parallel to the direction of transport prevents panel damage during processing, and the drying systems ensure minimal energy loss during baking.