Keywords
Citation
Exhibitions and conferences (2002), "Electronic Circuits World Convention", Circuit World, Vol. 28 No. 4. https://doi.org/10.1108/cw.2002.21728dac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Electronic Circuits World Convention
Electronic Circuits World Convention7-9 October 2002
Keywords: Electronics, Meetings
ECWC9 and EPC2002 are the most important events in the European printed circuit/ interconnection industry calendar for the year 2002, and is supported by the World Electronic Circuits Council (WECC) as one of the leading international events, amongst others, like IPC Expo and JPCA.
The purpose of the Electronic Circuits World Convention is to provide a forum for the interchange of Technical and Management concepts used on a worldwide basis. ECWC9 will focus on the latest research and the new-future innovation on interconnection, packaging, and assembly of electronic and opto-electronic circuits. Delegates and visitors from throughout the world will attend this event, offering presenters the opportunity to reach a wide audience of decision makers and leaders of the international packaging and interconnection industry.
On February 4 and 5 the Programme Committee of ECWC9 met in order to prepare the provisional programme of the world conference. Out of 180 abstracts that were sent in to all participating associations the committee chose 75 papers that will be presented at the conference.
The conference papers will be divided into three main tracks: Management, Materials and Processes.
Management sessions include papers on:
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Environmental considerations
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Electronic packaging design
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Regional market development
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Future printed circuit technologies
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Management software tools
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Understanding market demand
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Management strategies
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Business & manufacturing efficiencies
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Global market conditions
Materials sessions include papers on:
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Dielectric construction solutions
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High performance laminate materials
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Embedded component technology
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Embedded component materials
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Advanced dielectric materials
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Solder selection methodologies
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Conductive properties of metals
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Assembly technology decisions
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Semiconductor packaging impacts
Process sessions will include papers on:
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Leading edge printed board technologies
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Future imaging processes
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Signal integrity characterization
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Advanced plating processes
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Via hole technology challenges
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High density interconnects
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Multilayer implementation
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Multilayer registration
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Automatic optical inspection trends
For further information, or an up to date list of papers, please visit: www.eipc.org