Shipley Company and copper to copper form strategic partnership

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2003

56

Keywords

Citation

(2003), "Shipley Company and copper to copper form strategic partnership", Circuit World, Vol. 29 No. 4. https://doi.org/10.1108/cw.2003.21729dab.012

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


Shipley Company and copper to copper form strategic partnership

Shipley Company and copper to copper form strategic partnership

Keywords: Shipley

Shipley Company, L.L.C., has announced a strategic partnership with Copper to Copper, L.L.C. (C2C), a New Hampshire based company. Shipley, a subsidiary of Rohm and Haas Company (NYSE:ROH), will partner with C2C to expand its North American printed wiring board offerings. Details of the agreement were not disclosed.

As part of this partnership, Shipley will become the exclusive distributor of C2C lamination foils for use in the lamination process of multi-layer printed circuit boards. Together, the two companies will provide printed wiring board manufacturers among the most advanced copper and aluminum lamination foils available in the marketplace. Shipley's world-class distribution and service network will support customers in using the C2C product line.

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