Image capture and processing for 3D X-ray inspection system

Citation

(2010), "Image capture and processing for 3D X-ray inspection system", Circuit World, Vol. 36 No. 4. https://doi.org/10.1108/cw.2010.21736dad.001

Image capture and processing for 3D X-ray inspection system

Article Type: New products From: Circuit World, Volume 36, Issue 4

STEMMER IMAGING has supplied GÖPEL electronic GmbH with machine vision systems for use in its new OptiCon X-Line 3D X-ray inspection system for simultaneous inspection of both sides of double-sided printed circuit boards. Parallel image capture allows real time 3D X-ray image reconstruction from 2D images taken at different angles at production line speeds.

At the heart of the image capture system is a 3D parallel X-ray detector developed in-house by GÖPEL. This allows the simultaneous capture of images from nine different directions in a 12 bit grey scale with a maximum object resolution of 10 μm/pixel. The detector hardware achieves continuous data rates of up to 40 gigapixels/s.

Following hardware-based image integration and pre-processing there are 360 megapixels/s distributed over nine angles of observation available for further processing in the PC. In the reconstruction process, the image data are converted into a 3D output of typically 24 megapixels/s. As each projection captures a different region of the board, the board is moved under the X-ray beam so that all the required angles of observation are observed sequentially.

For more information, please visit the web site: www.stemmer-imaging.co.uk