Reliability Analysis and Failure Cause Determination in Encapsulated Semiconductor Devices

Abstract

This article describes reliability analysis and failure cause determination in encapsulated semiconductor devices. Such devices were subjected to a destructive life test using temperature as an accelerating stress. Once the devices had failed, the failure data were statistically analysed with the aid of a digital computer. The failed devices were then decapsulated and failure causes were determined using different types of microscopy. The article gives detailed information about the tests and analysis mentioned above.

Citation

Barry, D.M. (1985), "Reliability Analysis and Failure Cause Determination in Encapsulated Semiconductor Devices", International Journal of Quality & Reliability Management, Vol. 2 No. 2, pp. 33-46. https://doi.org/10.1108/eb002847