De‐Wetting of Fused Tin/Lead Plated Printed Wiring Boards

Abstract

The increase in printed wiring boards exhibiting de‐wetting characteristics after the fusing of electroplated tin/lead coatings prompted this investigation. Although it became clear during the course of the investigation that the development of the resist was a contributing factor to de‐wetting, it was shown that the sulphate ion concentration of the final rinse before tin/lead plating was the major cause of de‐wetting.

Citation

Williams, R. (1974), "De‐Wetting of Fused Tin/Lead Plated Printed Wiring Boards", Circuit World, Vol. 1 No. 1, pp. 37-39. https://doi.org/10.1108/eb043511