Products ♦ Processes ♦ Materials ♦ Equipment
21
Abstract
A new gold electroplating process introduced by Imasa/Silvercrown has been developed specifically for the bonding of silicon chips to leadframes in the manufacture of integrated circuits.
Citation
(1975), "Products ♦ Processes ♦ Materials ♦ Equipment", Circuit World, Vol. 1 No. 2, pp. 30-32. https://doi.org/10.1108/eb043515
Publisher
:MCB UP Ltd
Copyright © 1975, MCB UP Limited