Treatment of Copper Surfaces in Printed Circuit Manufacture

Abstract

Copper surfaces of laminates can be damaged by abrasively brushing prior to chemical processing. This is especially important where gold plated edge connectors are made to the latest Post Office specification of 2·5 µm. Chemical rather than abrasive treatment results in a pore‐free surface which is vital when the gold is thin.

Citation

Menzies, G.D.M. (1981), "Treatment of Copper Surfaces in Printed Circuit Manufacture", Circuit World, Vol. 7 No. 2, pp. 39-40. https://doi.org/10.1108/eb043636