Pressing Flex and Rigid‐flex in a Vacuum Press

Abstract

The vacuum press when used for lamination of flex and rigid‐flex printed wiring boards produces boards which exhibit better dimensional stability and better fill characteristics at lower pressures than when a conventional hydraulic platen press is used. This paper presents how lamination with a vacuum press differs from lamination with a hydraulic press and what results can be achieved with this new type of equipment technology.

Citation

Hinton, P.E. (1987), "Pressing Flex and Rigid‐flex in a Vacuum Press", Circuit World, Vol. 13 No. 2, pp. 46-47. https://doi.org/10.1108/eb043869