Three‐dimensional Circuitisation of Plastic Mouldings
B.J. Stevens
(General Hybrid Ltd, Jarrow, Tyne and Wear, England)
27
Abstract
This paper briefly discusses various solutions to 3‐D PCBs by giving an overview of available technologies. Specific attention is then directed to the author's company's technique. Coverage of aspects such as: Potential Market Size and Relationship to Existing Technologies, Functional Specification, Test Results, and Low Tool Costs is given.
Citation
Stevens, B.J. (1987), "Three‐dimensional Circuitisation of Plastic Mouldings", Circuit World, Vol. 13 No. 4, pp. 24-25. https://doi.org/10.1108/eb043898
Publisher
:MCB UP Ltd
Copyright © 1987, MCB UP Limited