Pulse Plating of Electrolytic Copper

Abstract

The paper outlines the application of a unique Pulsed Current technique to the Acid Copper Electrolyte used in the PCB industry. It discusses some of the inherent difficulties associated with conventional DC plating and how these pulsing techniques can overcome them to enable the production of a higher quality product despite the ever increasing demands being placed on manufacturers for better distribution and through‐hole plating.

Citation

Montgomery, A. (1989), "Pulse Plating of Electrolytic Copper", Circuit World, Vol. 15 No. 2, pp. 33-35. https://doi.org/10.1108/eb043971