PCB Vacuum Bonding Autoclave—Vacuum Bagging Techniques
G. Ford
(International Computers Ltd (ICL), Kidsgrove, Staffordshire, England)
51
Abstract
This paper describes the new technique used by International Computers Limited for vacuum bagging multilayer PCB bonding stacks. It is used as a cost‐effective alternative to previous consumable bagging systems used in autoclave vacuum bonding.
Citation
Ford, G. (1989), "PCB Vacuum Bonding Autoclave—Vacuum Bagging Techniques", Circuit World, Vol. 15 No. 2, pp. 36-36. https://doi.org/10.1108/eb043972
Publisher
:MCB UP Ltd
Copyright © 1989, MCB UP Limited