Non‐conventional Substrates
G. Messner
(PCK Technology Division, Kollmorgen Corporation, New York, USA)
40
Abstract
This paper describes recent printed board applications in circuit manufacturing on novel non‐laminate substrates. It specifically discusses properties pertinent to metal core, thermal plastics, and new processing conditions for circuitising the new substrates. Techniques explored are intended to provide rigidity, flatness, dimensional stability and improved thermal management.
Citation
Messner, G. (1985), "Non‐conventional Substrates", Circuit World, Vol. 11 No. 2, pp. 39-41. https://doi.org/10.1108/eb045990
Publisher
:MCB UP Ltd
Copyright © 1985, MCB UP Limited