Laminating Flexible and Flexi‐rigid Circuit Boards in the Isostatic Gas‐pressure Vacuum Press
W. Stein
(Robert Bürkle GmbH, Freudenstadt, W. Germany)
35
Abstract
Description of the vacuum press process with comparisons made between the isostatic gas pressure and hydraulic press technologies: advantages of the former: materials for flexible and flexi‐rigid circuit production in the vacuum press.
Citation
Stein, W. (1988), "Laminating Flexible and Flexi‐rigid Circuit Boards in the Isostatic Gas‐pressure Vacuum Press", Circuit World, Vol. 14 No. 3, pp. 45-48. https://doi.org/10.1108/eb046019
Publisher
:MCB UP Ltd
Copyright © 1988, MCB UP Limited