Keywords
Citation
(1999), "IVF research projects", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aab.001
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
IVF research projects
IVF research projects
Keywords IVF, Microelectronics, Research, Sweden
An overview of the Mechanical Electrical Integration Programme (MEI) at IVF, Sweden and the various research projects being undertaken
Miniaturised microwave componentsIn microwave design, the increasing use of higher operating frequencies set new requirements for the components and the materials used. New materials and technologies offer possibilities for obtaining microwave systems with increased reliability and reduced weight and cost. At IVF, a study on miniaturisation of microwave components has been performed where the performance of an electroless plating technology has been investigated.
This method of applying thin conducting layers on e.g. composites will be an interesting way of manufacturing components for a wider range of applications in the future.
Future work will be directed towards the manufacture of a demonstrator in co-operation with Saab Ericsson Space (SES) and Polymer Kompositer (PK). The objective is to develop a horn antenna which will be produced this autumn by SES using a traditional technique. In parallel with this work, IVF will study how this antenna may be manufactured using an economically advantageous manufacturing process for a supporting substrate which is suitable for the plating process at PK. The antenna properties for both types of manufactured antennas will then be compared. Lennart Hasselgren, lh@ivf. se
Laser machiningJoining is a very important integration process and because "difficult" materials often are included in mechatronic constructions, a special effort bas been directed towards using laser as a production tool (Figure 1). Two Nd:YAG-lasers were successfully used when welding thin Al sheets down to 89µm. Aluminium has many properties favourable for mechanical electrical constructions, but it is relatively difficult to weld in small dimensions due to its low viscous melt, high heat conductivity, and its affinity for oxidation. High continuous laser power levels in the range 1,000-2,500W and intensities around 0.5-3MW/cm, however, produced average weld quality at speeds of 18-35m/min for the Al sheets. Porosity, however, is a problem that still needs to be solved.
In one or two years the high power diode laser will open up new opportunities for processing (welding, soldering, hardening) of metals at a comparatively low cost. The technique is relatively new but today there are commercial diode lasers, or rather diode laser matrixes, with continuous power up to 4kW. In the MEI project tests on laser soldering are planned with the selective joining of components to flex substrate as a goal. Diode lasers with high intensity (200kW/cm2) exist today, primarily used for soldering and welding of plastics and hardening, but a breakthrough is expected. IVF will purchase diode laser equipment, which initially will be used primarily for projects on welding of polymers and soldering on flex within the MEI project. Thomas Nilsson, tn@ivf.se.
Figure 1The diode laser soldering project
European co-operation, lasersIFW in Jena, Germany is an institute for joining, testing, and education in the area of welding with which we plan co-operation within the Eureka programme. Co-operation with a German network for "micro technique production" supported by BMF-T is also planned.
Thus MEI has given IVF opportunities for European co-operation. Magnus Widfeldt, mw@ivf.se
MountingIn the mounting project an ongoing work group focuses on part transfer/feed and design of a grabbing tool.
In the area of part transfer/feed they have studied feeding tools developed within the Eureka project "Flexfeed". The purpose was to find solutions on how to modify these tools for feeding small details. A large number of solutions have been suggested and tests of some of the solutions are planned.
A new principle for design of a grabbing tool has also been developed within the workgroup. A prototype has been built and tested in a robotic cell. The grabbing tool was manufactured at low cost and the performance exceeded the expectations. Björn Langbeck, bl@ivf.se
European co-operation, mountingThree European companies have been visited. Mikron SA Boudry in Switzerland is developing equipment for micro mounting. They show great interest in collaborating with IVF, e.g. by lending equipment.
EPFL in Lausanne works in the area of micro mounting. The IVF visit clearly confirmed the sharp boundary that exists between micro- and mini-mounting.
ACS in Germany delivers equipment to companies working in the mini mounting area. The company is interesting as a collaborator. They have a dedicated effort to standardise their products and components. They deliver both complete systems and individual components that can be tailored to an application. Björn Langbeck, bl@ivf. se
Mini mountingA planned project which will be defined in detail during the autumn. Björn Langbeck, bl@ivf. se
The demonstrator projectThis project will demonstrate how electrical and mechanical systems can be integrated. The functions of a micro system can briefly be described as the interaction between the micro system and the environment, and the interaction between the micro system and the user or other systems. One of the biggest obstacles for commercialising micro systems is to qualify the interaction between the system and the environment. The interaction between the micro system and the user, or other systems, is usually realised through an electronic interface. Direct integration of microsystems and microelectronics has proved to be difficult due to incompatibility between the different processes. This means that the two parts will have to be joined afterwards. The electrical contact between the systems will be provided by a common carrier. Primarily the integration between the electronics and the microsystem will be studied. Another purpose of the demonstrator project is to include as many of the processes studied in the MEI project as possible. Per Carlsson pc@ivf.sc
Battery integrationIntegration of batteries in electronics is becoming more and more important for increased functionality. The development of the mobile phone has put very strong pressure on battery manufacturers to develop batteries that are lighter, smaller, more environmentally friendly, and with higher capacity. A prerequisite for integrating batteries with electronics is to overcome the geometrical restrictions. The project will assess the possibility of manufacturing batteries that are thin and possibly integrated in the substrate or chassis of the apparatus. Per Carlsson, pc@ivf. se
Pre-study photolithography/etching and platingDifferent possibilities for selective deposition with the aim to link electronic devices on a plastic shell were surveyed. Included in the survey were different lithographic techniques, deposition of metals on plastic materials and the possibility of forming an ingot mould from silicon. Göran Stenberg, gsg@ivf. se
Pre-study PVD/CVDThe potential for MEI of the thin film technologies physical vapour deposition (PVD) and chemical vapour deposition (CVD) was investigated. The study focussed on small mechanical components (<2cm3). By depositing a thin film on the component its properties can be tailored, to e.g. get higher mechanical strength, better tribological properties and higher chemical resistance. Göran Stenberg, gsg@ivf. se