Chip scale packaging will not affect bare die market

Citation

(1999), "Chip scale packaging will not affect bare die market", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aab.011

Chip scale packaging will not affect bare die market

Chip scale packaging will not affect bare die market

Keywords Chip scale packaging, Semi Dice

According to recently released results from the 1998 Semi Dice Inc. Bare Die Survey, chip scale packaging (CSPs) will have little effect on the future of the bare die market.

Of 21 leading semiconductor companies which responded to the study, only 8 percent anticipate that CSPs will replace bare die (Figures 1 and 2). Of 27 circuit manufacturers who responded to the study, 54 percent said they did not intend to replace any bare die with CSP. Of the circuit manufacturers, 25 percent said they intend to replace less than a quarter of current bare die with CSP.

"Bare die is the ultimate solution to the search for smaller is better," said Mitch Myers, president and COO of Semi Dice, Inc. "After all, the best package is no package at all. You just can't get any smaller than bare die."

In an effort to evaluate, monitor and educate the electronics industry about bare die, Semi Dice Inc. conducted the 1998 Semi Dice Inc. Bare Die Survey. The survey was first done in 1997, but its distribution was limited to semiconductor manufacturers. The 1998 survey was designed to serve as a barometer of the bare die industry, enabling semiconductor and circuit manufacturers to predict trends and better manage the curves of this dynamic market.

The 1998 Semi Dice Inc. Bare Die Survey was distributed to representatives of 47 major semiconductor manufacturers and 56 major circuit manufacturers. Approximately 50 percent of the surveys were completed, returned and analyzed. The two 15-question surveys addressed issues such as the technical and market factors that affect bare die use, the importance of KGD, and current and future opportunities for bare die use. Semi Dice plans to conduct the survey annually.

Figure 1Does your company anticipate chip scale package product?

Figure 2Does your company intend to replace some bare die with chip scale packaging?