Citation
(2001), "IMAPS USA. Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS", Microelectronics International, Vol. 18 No. 2. https://doi.org/10.1108/mi.2001.21818bab.006
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
IMAPS USA. Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS
IMAPS USA
Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS
IMAPS is sponsoring an Advanced Technology Workshop (ATW) on Optoelectronics Packaging, to be held 11-14 October 2001 at the Hotel Bethlehem in Bethlehem, Pennsylvania.
The optoelectronics component industry has enjoyed a period of unprecedented growth spurred on by the insatiable desire for higher data rate transmission and increased bandwidth. This ATW will bring together scientists and engineers from industry, academia and government to address the unique technical challenges faced by all in the optoelectronic packaging arena. The workshop begins with a Thursday night kick off and Keynote address by John Pittman of Agere Systems. Friday's session addresses the packaging challenges posed by the various device types, e.g. detectors, modulators, amplifiers, MEMS etc. along with their associated packaging processes. Saturday's sessions are all about alignment and automation issues. The evening session will be held across the river on the scenic campus of Lehigh University, where the focus will redirect to attachment and materials issues in opto packages. One of the ATW's highlights will be "The new kids in town". With a multitude of start-ups in the area, attendees will have the opportunity to interact and learn first hand some of the unique packaging issues and challenges facing new start-up companies. Plenty of social time is planned to facilitate informal interaction among attendees.
Further details: General Chair: Thomas Green. Tel: +1 610 861 4128; E-mail: tgreen@northampton.edu; Technical Chair: Bill Heffner, Tel: +1 610-939-3854; E-mail: wheffner@lucent.com