Keywords
Citation
(2003), "Thermoset announces new fast cure adhesive MT-125", Microelectronics International, Vol. 20 No. 2. https://doi.org/10.1108/mi.2003.21820bad.006
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Thermoset announces new fast cure adhesive MT-125
Thermoset announces new fast cure adhesive MT-125
Keyword: Adhesives
Thermoset, Lord Chemical Products has developed an innovative thermal interface material – MT-125. This fast cure, high bond strength adhesive has a bulk thermal conductivity of 2.35 W/m°K. MT-125 can quickly be cured in 8 min @ 150°C or 30 min @ 100°C. Due to its fast cure in inline ovens, PC board and device manufacturers can achieve high throughput in automated assembly operations. This new material has a low CTE of 31 ppm (Alpha 1) and a Tg of 123°C. Due to its low CTE, MT-125 can help alleviate thermal mismatches between various interfaces and improve temperature cycling and temperature shock performance. MT-125 has a pot life of 2 weeks @ 25°C and exhibits excellent adhesion to a variety of substrates including gold, silicon, ceramic and nickel.
This adhesive is engineered to dispense easily using automated equipment and is ideally suited for bonding heat sinks, FanSinks and Thermal Electric Coolers to ceramic, plastic and metal packages. MT-125 is designed to provide a high performance interface solution where a mechanical attach is not possible or desired.