Ultrasonic sieving in the laboratory

Pigment & Resin Technology

ISSN: 0369-9420

Article publication date: 1 February 2005

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Keywords

Citation

(2005), "Ultrasonic sieving in the laboratory", Pigment & Resin Technology, Vol. 34 No. 1. https://doi.org/10.1108/prt.2005.12934aad.009

Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited


Ultrasonic sieving in the laboratory

Ultrasonic sieving in the laboratory

Keywords: Ultrasonics, Instruments, Equipment

Ultrasound can be used for the acceleration of sieving processes, particularly in case of very fine materials when it may be the only way to enable the sieving at all. Hielscher has developed a worldwide unique technology especially for exciting common laboratory ring sieves (according to DIN ISO 3310/1 or ASTM E 11-95) with diameters of 100-400 mm.

A ring sonotrode that fits the sieve is excited by the ultrasonic processor UIS250L. The ring sonotrode transmits the oscillation via the sieve frame to the screening surface. With the help of the clamping fixtures the neighbouring sieves are also excited. In contrast to the ultrasonic sieving processes known until now, in which each sieve needs its own ultrasonic excitation, this is a very inexpensive and flexible solution.

Another advantage of this exciting principle is that the transducer is situated outside the material to be sieved. This technology can be used for dry or wet sieving, as well as for cleaning the sieves. The ultrasonic components can be retrofitted into already existing sieving towers and can even be used in combination with vibrators. In this case, the delivery scope consists only of the ultrasonic processor UIS250L and the ring sonotrode, which will be fitted into the common laboratory ring sieves of most manufacturers.

On request Hielscher can also offer the required laboratory analysis sieves. Furthermore, it is possible to integrate a sieving pump into the cover of the sieving tower.

The pump enhances the sieving power especially in the case of adhesive powders.

For more information, visit the Web site: www.hielscher.com/ultrasonics/lab.htm

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