New thermal conductive epoxy film and preforms now available

Pigment & Resin Technology

ISSN: 0369-9420

Article publication date: 16 January 2007

78

Citation

(2007), "New thermal conductive epoxy film and preforms now available", Pigment & Resin Technology, Vol. 36 No. 1. https://doi.org/10.1108/prt.2007.12936aad.002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited


New thermal conductive epoxy film and preforms now available

New thermal conductive epoxy film and preforms now available

Master Bond Inc., Hackensack NJ has introduced a new thermally conductive, electrically insulative epoxy adhesive film and preform called FL901AO. This new advanced technology offers significant processing and performance advantages over similar commercially available products. Specifically Master Bond FL901AO can be stored at ambient temperatures for up to 3 months without refrigeration. Cures can be obtained at 250ºF in one hour or 300ºF in only 30min. Master Bond FL901AO exhibits high thermal conductivity and is an excellent electrical insulator. It has impressive bonding capabilities and maintains its properties even upon prolonged exposure to harsh environmental conditions such as moisture and other chemicals and/or heat. Unlike conventional products FL901AO features outstanding resistance to thermal shock, vibration and impact. Master Bond FL901AO is available in a wide range of film thicknesses. The standard film thickness is 3mil. Preforms can be laser or die cut to the configuration of any part.

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