Citation
(2008), "Heat reactive transfer adhesive for smart card chip bonding", Pigment & Resin Technology, Vol. 37 No. 5. https://doi.org/10.1108/prt.2008.12937ead.003
Publisher
:Emerald Group Publishing Limited
Copyright © 2008, Emerald Group Publishing Limited
Heat reactive transfer adhesive for smart card chip bonding
Article Type: New products From: Pigment & Resin Technology, Volume 37, Issue 5
For smart card manufacturing, Scapa North America has introduced Thermofilm G185A, a heat reactive transfer adhesive designed to permanently bond smart card chips and reinforce security. This product complies with various dielectric films including glass epoxy and polyimide.
Thermofilm G185A is a co-polyamide film ideal for banking and telecommunication card applications. The product exhibits high-bonding performance on PVC, ABS, and PVC/ABS blends, and will destroy the card if removed. At just 1.8 mils thick, this transfer adhesive exceeds ISO requirements.
This product is approved for use on SIM, dual interface, contactless, and multifunctional cards as well as for passport assembly and inlay insertion in E-passports.
Source: Scapa North America.