Versatile new soldering and desoldering machines from Zevac

Citation

(2000), "Versatile new soldering and desoldering machines from Zevac", Soldering & Surface Mount Technology, Vol. 12 No. 3. https://doi.org/10.1108/ssmt.2000.21912cad.013

Versatile new soldering and desoldering machines from Zevac

Versatile new soldering and desoldering machines from Zevac

Keywords Zevac, Component handling

The New Zevac SSM series of soldering and desoldering machines (Plate 4) offer a wide range of through-hole multi-leaded component options. The interchangeable flow wells allow multilayer boards and large components such as DIP switches, pin grid arrays and long multi pin edge connectors to be handled with ease. Precise reflow on dense mixed technology boards is achievable by using specific flow wells and hole clearance through the blow out system and hood. The most complex soldering and desoldering on double sided PCBs up to 600mm² is possible. The SSM4 includes controls for pump speed and solder pot temperature and the SSM9 features microprocessor controlled storage of solder/desolder profiles.

Plate 4 The Zevac SSM9

Further information: Tony Chapman Electronics. Tel: +44 (0) 1992 578231; E-mail: sales@tceltd.co.uk; http://www.tceltd.co.uk