Citation
(2001), "Call for papers", Soldering & Surface Mount Technology, Vol. 13 No. 2. https://doi.org/10.1108/ssmt.2001.21913bac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Call for papers
Call for papers
Event: APEXSM 2002Date: January 20-24 2002Venue: San Diego Convention Center, San Diego, CA, USAAbstract deadline: 31 May 2001
Selected papers will be published in the technical proceedings for APEX 2002, which is distributed to more than 1,500 companies and individuals throughout the electronics assembly industry. Papers are being sought on design, materials, assembly, processes and equipment in all areas dealing with:
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advanced packaging;
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assembly process;
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factory equipment and automation;
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material developments;
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components;
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soldering (including lead-free);
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board-level reliability;
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environmental concerns;
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electronic manufacturing services;
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manufacturing test and quality;
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industry standards;
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business issues.
Papers should be between six and 12 pages in length (text and graphics), and should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Previously published papers and papers focused on a company's products will not be accepted.
Abstracts summarizing the topic must be received by 31 May 2001 and should be approximately 300 words long. Please submit abstracts online at http://www.GoAPEX.org/html/CFPAPEX2002.htm
Further details: Martin Barton, APEX conference director. Tel: +1 972 424 8805; E-mail martinbarton@home.com