Keywords
Citation
(2001), "Quick cure thick encapsulant", Soldering & Surface Mount Technology, Vol. 13 No. 3. https://doi.org/10.1108/ssmt.2001.21913cad.014
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Quick cure thick encapsulant
Quick cure thick encapsulant
Keyword: Encapsulant materials
New Dymax 9-20558 thick film coating provides a transparent layer that protects underlying circuitry and components from moisture, dust and other contaminants. It cures in seconds on exposure to UV and visible light (see Plate 10).
The flexible encapsulant adheres to and forms a protective coating over a wide variety of surfaces including glass-filled epoxy, metal and ceramic – as well as Kapton, making it ideal for use on flexible circuits. It features a secondary heat-curing capability and flow characteristics designed for quick coverage without running. Cure time is 20-30 seconds, even under standard longwave, moderate-intensity light (200m W/cm2), and cure depths of 1/4 in. are possible.
Plate 10 The
new Dymax 9-20558 thick film coating cures in seconds on exposure to UV and
visible light
Full details of Dymax 9-20558, technical specifications and availability on 01 865 842842, or visit www.intertronics.co.uk