Citation
(2002), "International diary", Soldering & Surface Mount Technology, Vol. 14 No. 1. https://doi.org/10.1108/ssmt.2002.21914aac.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
International diary
IPC Expo 2002
24–30 MarchLong Beach Convention Center, CA, USAIPCWWW: www.ipcprintedcircuitexpo.org
Nepcon Shangai
9–12 AprilShanghai Everbright Convention & Exhibition Centre, Shanghai, ChinaReed Exhibition Companies (REC) CCPITElectronics & Information-Industry Sub CouncilTel: +(852) 28240330 Fax: +(852) 28240178E-mail: shermen.ho@reedexpo.com.hkWWW: www.nepconchina.com
EuroSimE 20023rd International Conference on Benefiting from Thermal and Mechanical Simulation in Microelectronics
14–17 AprilParis, FranceWWW: www.eurosime.com
2002 International Conference on Electronics Packaging (ICEP) and 16th Microelectronics Show
17–19 AprilTokyo Ryutsu Center, Tokyo, JapanJIEPTel: +81-3-5310-2010 Fax: +81-3-5310-2011E Mail: imaps-j@jiep.or.jpWeb: http://www.jiep.or.jp/jiep/icep/index.html
Electronic Week 2002
24–26 AprilCOEX, Seoul, KoreaKyungyon Exhibition CorporationTel: +82 2 785 4771 Fax: +82 2 785 6117WWW: www.electronicweek.org
FiberComm
4–6 JuneMunich Messe, Munich, GermanyMesse München GmbHTel. (+ 49 89)949-20315Fax (+ 4989)949-20319E-mail: sixl@messe-muenchen.de
Nepcon East
10–12 JuneBayside Expo & Convention Center, Boston, MA, USATel: +1 203-840-5344 Fax: +1 203-840-9344WWW: www.nepcon.com/nepconeast/suggest.asp
IMAPS Israel 2002
13 JuneDaniel Hotel, Herzelia – On – Sea, IsraelWebsite: www.imaps.org
European Microelectronics Packaging & Interconnection Symposium
16–18 JuneSofitel Hotel, Cracow, PolandSelim AchmatowiczTel.: +48 22 835 30 41 ext. 457Fax: +48 22 834 90 03E-mail: achmat_s@wa.onet.plhttp://www.itme.edu.pl/imaps.cracow2002/index.html
SMT/Hybrid/Packaging
18–20 JuneMessezentrum, Nürnberg, GermanyMesago GmbHTel: +49-711-61946-79Fax: +49-711-61946-93WWW: www.mesago.de
Globaltronics
3–6 SeptemberSingapore ExpoReed Exhibition CompaniesTel: +65 434 3615 Fax: +65 334 2748Email: tracey.khoo@reedexpo.com.sgWWW: www.globaltronics.com.sg
IMAPS USA
4–6 SeptemberColorado Convention Center, Denver, CO, USAIMAPSTel: +1 202 548 4001E-mail: imaps@imaps.orgWebsite: www.imaps.org
Nepcon UK
1–3 October 2002NEC Birmingham, Halls 1 & 2Reed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608WWW: www.nepcon.co.uk
EPC2002 – European PCB Convention & ECWC9 World Conference
October 8–10Koln Messe, Cologne, GermanyEIPC Services GmbHTel: +41 61 482 3900 Fax: +41 61 482 3910E-mail: bborn@eipc.orgWebsite: http://www.eipc.org
Electronica 2002 – The 20th International Trade Fair for Components & Assemblies in Electronics
November 12–15New Munich Trade Fair Centre, Munich, GermanyPress Officer: Angela PragTel: +49 89 949-20670Fax: +49 89 949-20679praeg@messe-muenchen.deWebsite: www.electronica.de
NEPCON WEST
December 4–6McCenery Convention Center,San Jose CA, USAPhone: 203-840-5689Fax: 203-840-9689Website: www.nepconwest.com
2003 Nepcon UK South
2–3 April 2003Brighton Metropole, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608WWW: www.nepcon.co.uk
SMT/Hybrid/Packaging
6–8 MayMessezentrum, Nürnberg, GermanyMesago GmbHTel: +49-711-61946-79Fax: +49-711-61946-93WWW: www.mesago.de
Nepcon UK North
16–17 September 2003Harrogate International Centre,Harrogate, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608WWW: www.nepcon.co.uk
2004 Nepcon UK
October 2004NEC Birmingham, EnglandReed Exhibition CompaniesTel: + 44 (0)20 8910 7706Fax: + 44 (0)20 8334 0608WWW: www.nepcon.co.uk