Keywords
Citation
(2002), "IPC. Inaugural IPC/JEDEC conference helps get the lead out", Soldering & Surface Mount Technology, Vol. 14 No. 3. https://doi.org/10.1108/ssmt.2002.21914cab.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IPC. Inaugural IPC/JEDEC conference helps get the lead out
Inaugural IPC/JEDEC conference helps get the lead out
Keywords: IPC, Conference
IPC and JEDEC report that more than 290 individuals attended its first International Conference on Lead-Free Electronic Components and Assemblies. The conference, sponsored by IPC and JEDEC – the Solid State Technology Association, took place 30 April-2 May, 2002, in San Jose, California.
At the lead-free conference, IPC's Solder Products Value Council held its management meeting. The council, established with the goal of creating programs to benefit both solder manufacturers and their customers, announced that they would be investigating tin/3.0 silver/0.5 copper as the standard alloy on which they would like to see the industry standardize.
San Jose was also the initial opportunity to discover the first lead-free US product: Motorola's lead-free cell phone. In addition, Boeing Phantomworks looked at the leachability of silver from tin/silver/copper alloys and Technic's presentation on a tin finish that resists whisker growth was well received by the attendees. The lead-free conference also featured company positions established by Siemens and Hewlett Packard and the road- mapping activities in Japan and Europe.