Citation
(2002), "New AOI-system to inspect solder paste in 2-D", Soldering & Surface Mount Technology, Vol. 14 No. 3. https://doi.org/10.1108/ssmt.2002.21914cad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
New AOI-system to inspect solder paste in 2-D
New AOI-system to inspect solder paste in 2-D
GOEPEL electronic has extended the assortment of its AOI-systems and presents a tool for the two- dimensional solder paste inspection named "OptiCon Paste Inspector 2-D" (Plate 3).
Plate
3 The Opticon Paste Inspector 2-D
The new system allows checking the solder paste print of for position and missing or blurred solder past.
The heart of the system is a matrix-camera with a shadow free illumination unit. The solder paste is recognized on basis of a detection algorithm, which also in the threshold exactly separates solder paste, PCB background and pad. Even different basis materials and solder stop lacquer have no influence on the test result. The system allows an inspection of PCBs of maximal 400 x 430 mm.
A comfortable user interface allows the system to be programmed. Thus, the user has the possibility of reading in the scan ranges (test steps) via CAD data import, or determining them automatically through manual specification.
Particular test steps can also be deleted which can be very useful for the solder paste inspection of big pads. Because the fault probability on big pads is rather small such selections reduce the test time. The user interface permits the starting of particular test steps manually, which is advantageous especially during the print process. Via the configuration menu the user is able to determine defaults for pad groups or even each single pad such as the maximal and minimal height of the solder paste. The faulty solder paste coating is indicated after the inspection. A visualization tool permits the graphical presentation of the test range and results. Thus, the user has got a valuable tool to optimise the solder paste print.