Pin-in-hole reflow specialist proves fit-for-purpose stencils

Citation

(2003), "Pin-in-hole reflow specialist proves fit-for-purpose stencils", Soldering & Surface Mount Technology, Vol. 15 No. 1. https://doi.org/10.1108/ssmt.2003.21915aad.005

Pin-in-hole reflow specialist proves fit-for-purpose stencils

Pin-in-hole reflow specialist proves fit-for-purpose stencils

Keywords: Reflow, Stencil

As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow (PIHR), Dorset based stencil specialist Tecan, continues to boost its share of this developing new market, by providing feasible custom stencil solutions (Plate 4).

Plate 4 Tecan continues to boost its share of the PIHR

PIHR is a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board. Using a combination of multi-level stencils and reactive squeegees in a single operation, PIHR can eliminate the need for subsequent hand or wave soldering. The technique ensures that appropriate paste volumes are deposited, for SM and through-hole components simultaneously. This produces shorter product cycle times, reduces manufacturing costs, eliminates secondary flux deposition and negates the need for subsequent hand or wave soldering.

For more information, visit: www.tecan.co.uk