Small reflow oven for lead-free SMT

Citation

(2004), "Small reflow oven for lead-free SMT", Soldering & Surface Mount Technology, Vol. 16 No. 1. https://doi.org/10.1108/ssmt.2004.21916aab.017

Small reflow oven for lead-free SMT

Small reflow oven for lead-free SMT

Keywords: Reflow, Lead-free soldering

Essemtec is launching a new full convection reflow oven, the RO300FC (Plate 3). It is designed for high temperature soldering of sensitive electronics, and is therefore the ideal solution for lead-free soldering. The RO300FC is available exclusively in the UK and Ireland from Contax, the UK’s leading independent supplier of automated production machines.

Plate 3 The RO300FC from Essemtec

The R0300FC oven has a small footprint, and is available as a table top or stand model. Ideally suited for all reflow tasks or for the curing of adhesives, the R0300FC can be used either for continuous production or for small batch manufacturing.

The efficient convection heating ensures a consistently high temperature, with uniform heat distribution over the complete soldering range.

The system enables each heating zone to be individually regulated, so all types of temperature profiles can be designed. As the control provides a memory capability for programming customised temperature profiles, these processes can be stored and reproduced. The windows-based profiling software with drag and drop and thermocouples enables all processes to be measured, compared and documented.

However, for a simple set-up, there is a selection of preset standard profiles for SMT applications that are automatically set at the correct temperature profile.

The full convection reflow oven RO300FC is easy to use, offers perfect reflow results and is of a robust construction. For further information please contact: Tel: 01489 885808 (UK) or 01 878 0031 (Ireland).