Editorial

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 2005

195

Citation

Whalley, D. (2005), "Editorial", Soldering & Surface Mount Technology, Vol. 17 No. 1. https://doi.org/10.1108/ssmt.2005.21917aaa.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited


Editorial

Welcome to this first issue of SSMT for 2005. I'd like to firstly express my thanks to a group of people whose contributions over the previous year have been vital to the continuing success of the journal. These are the individuals who, in addition to the members of the Editorial Advisory Board, have contributed their time and expertise to the peer review process for the papers published in Volume 16:

Mr J Friedrich, ERSA Lottechnik, Germany

Dr C Hunt, National Physical Laboratory, UK

Dr J-P Jung, University of Seoul, South Korea

Mr P Ongley, Electronic Technology Services, UK

Dr F Sarvar, Loughborough University, UK

Professor K. N. Subramanian, Michigan State University, USA

Mr C Tanner, Qualitek Singapore, Singapore 637790

Dr P Tomlins, National Physical Laboratory, UK

Dr J H Vincent, Bookham Technology plc, UK

This year the publishers have significantly increased our page budget and from now on we will produce a total of four issues per year, rather than three. This has been made possible by the increasing number of high quality papers being submitted to me for publication and is an indication of the importance of soldering technology and how the fast approaching switch to lead free soldering is stimulating research activity in this field. Quarterly publication will also increase the timeliness of the regular news and diary items brought to you by our Associate Editor, Mr John Ling.

David WhalleyEditor

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