EID assembly solution of the year award for DEK's micron-class

Citation

(2005), "EID assembly solution of the year award for DEK's micron-class", Soldering & Surface Mount Technology, Vol. 17 No. 1. https://doi.org/10.1108/ssmt.2005.21917aab.013

EID assembly solution of the year award for DEK's micron-class

EID assembly solution of the year award for DEK's micron-class

Keywords: Electronics industry, Design

DEK's new micron-class high accuracy mass imaging platform is the Assembly Solution of the Year, judges at the Electronic Industry Design Awards have decided (Plate 3). The important technologies designed into the micron- class, which includes the Europa and Galaxy configurations, caught the panel's imagination over strong entries by other equipment and material developers.

Plate 3 (L-R) Zoe Walter, Protean Marketing Communications Ltd, Tim Fryer, Electronics Manufacture and Test (EM&T) and Rich Heimsch, DEK

These technical assistance and process support resources, being tightly linked with the mass imaging platform itself, were a key reason for micron-class' success. The revolutionary DEK Instinctive user interface now allows operators to confidently control extremely complex processes with less training than before. Features including intuitive graphical displays for consumable levels, with an indication of actual time before replenishment of solder paste, solvents and USC rolls allow operators to control the new machines more efficiently than ever before. On- board error recovery maximises up-time and allows non-expert staff to quickly take the optimal corrective action to restore full process functionality.

Micron-class machines also benefit from IP-based connection to DEK knowledge servers via the internet. This service, known as DEK Interactive, allows the user to establish communication with a DEK telephone helpdesk at the push of a button, and to share control of the machine with the helpdesk operator via the internet. Access to the content held on DEK's knowledge servers allows the operator to view tutorials, graphical examples and user guides for a wide range of machine sub- systems and processes. These include setting up tooling or inspection, optimising machine and process parameters and fine-tuning programs for optimum productivity.

The new platform is also fully compatible with important innovations such as DEK Virtual Panel Tooling, which allows multiple singular substrates to be imaged simultaneously, and semiconductor packaging solutions such as DirEKt Ball Placement. The latest ProFlow^w DirEKt Imaging developments, including the low volume transfer head for high value materials such as low-alpha solder pastes or conductive epoxies and thermal interface materials can also be used directly with micron- class machines.

“DEK's Micron-class is indeed the manufacturing solution of the year, and I am delighted that EID has recognised this by presenting the award to Galaxy at the EID awards dinner”, concluded Heimsch.

For further information, visit our web site: www.dek.com