JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline

Citation

(2006), "JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline", Soldering & Surface Mount Technology, Vol. 18 No. 3. https://doi.org/10.1108/ssmt.2006.21918cab.006

JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline

JEDEC and IPC release tin whisker acceptance testing standard and mitigation practices guideline

Keywords: Electronics industry, Trade literature

JEDEC and the International Electronics Manufacturing Initiative (iNEMI) have announced the availability of two documents intended to help manufacturers reduce the risk of tin whiskers in lead-free products. The first is JEDEC standard JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes,” and the second is a JEDEC/IPC joint publication, JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline”.

JESD201, developed by the JEDEC JC-14.3 Subcommittee on Silicon Device Reliability Qualification and Monitoring and the iNEMI Tin Whisker User Group, provides a uniform environmental acceptance testing and reporting methodology for tin whisker susceptibility of tin and tin alloy surface finishes used in the electronics industry. It is intended to be used with JESD22-A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes” (published May 2005, with a revision released in October 2005).

JP002 provides guidance in understanding the prevalent theories regarding tin whisker formation, the driving force behind tin whisker growth, and mitigation practices used to minimize whiskers. It serves as a source of background information for JESD22A-121and JESD201. The publication was developed by JEDEC's JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices in conjunction with the IPC 5-23e Tin Whiskers Guideline

JESD201, JP002 and JESD22- A121 can be downloaded from the JEDEC web site at: www.jedec.org/DOWNLOAD/search/JESD201.pdf; www.jedec.org/DOWNLOAD/search/JP002.pdf; www.jedec.org/download/search/22a121-01.pdf

Tin Whisker Workshop

iNEMI, in conjunction with IEEE, CPMT and ECTC, is sponsoring the Third Tin Whisker Workshop on May 30 as part of IEEE's Electronic Components and Technology Conference (ECTC; www.ectc.net). The full-day workshop in San Diego, California, will provide an update on work that has been done in both the testing and modeling of tin whiskers. In addition, a roundtable discussion will provide insight into the intent of the JEDEC/IPC specifications and will also discuss implementation of the new standards. For more information about the tin whisker workshop, go to: www.inemi.org/cms/calendar/06_ECTC_TW_Workshop.html industry needs and R&D initiatives. For additional information about iNEMI tin whisker activities, visit www.inemi.org/cms/projects/ese/tin_whisker_activities.html.