Siplace Precedence Finder optimizes placement sequence: effective collision protection for the placement process

Citation

(2009), "Siplace Precedence Finder optimizes placement sequence: effective collision protection for the placement process", Soldering & Surface Mount Technology, Vol. 21 No. 3. https://doi.org/10.1108/ssmt.2009.21921cad.005

Siplace Precedence Finder optimizes placement sequence: effective collision protection for the placement process

Article Type: New products From: Soldering & Surface Mount Technology, Volume 21, Issue 3

Siplace Precedence Finder is a special program that improves the quality and reliability of component placements on high-mix and high-density boards. Based on the bill of materials, the software analyzes the size and position of all components on the printed circuit board (PCB) and optimizes the placement sequence to prevent components from colliding with each other or with nozzles and grippers. It effectively eliminates frequent collision sources such as shielding (large height differences between adjacent components) or placement shadows as a result of overlaying nozzles.

To ensure a collision-free placement process on modern board designs, which are often very compact, the Siplace Precedence Finder collects geometric data and position information of the components and board itself from the placement list. Based on this information this special software calculates potential placement collisions and fixes the placement sequences in order to provide collision-free placement.

Wherever components with large height difference are positioned closely to each other, the smaller component is placed first in order to prevent the higher “neighbours” from getting in the way (shielding) and causing potential collisions.

As another special feature, the Siplace Precedence Finder takes the respective nozzle and gripper data into account as well. Even in cases where components are picked up off-centre, critical scenarios can be defined via corresponding tolerance thresholds to effectively avoid collisions with overlaying nozzles.

The Siplace Precedence Finder automates the analytical and optimization processes, which are often very complex and time-consuming. This speeds up the programming, accelerates new product introductions and improves the quality and reliability of the overall placement process starting with the first board moving down the line. Electronics manufacturers benefit from more productivity and less downtime caused by collisions.

Figure 2 The Siplace Precedence Finder prevents shielding and collisions

Even with such a high degree of automation, experienced programmer always have the possibility to verify any results from the Siplace Precedence Finder in detail and hence being able to confirm or overwrite any precedence rules (Figure 2).

For further information any interested users should contact their regional Siplace sales partner who can arrange for a temporary test licence.

For more details please contact: www.siplace.com