VJ Electronix, Inc. and BB Electronics A/S announce implementation of advanced scavenger technology in Denmark

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 6 April 2012

172

Citation

(2012), "VJ Electronix, Inc. and BB Electronics A/S announce implementation of advanced scavenger technology in Denmark", Soldering & Surface Mount Technology, Vol. 24 No. 2. https://doi.org/10.1108/ssmt.2012.21924baa.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited


VJ Electronix, Inc. and BB Electronics A/S announce implementation of advanced scavenger technology in Denmark

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 24, Issue 2

BB Electronics, a full service EMS company, announces that it has completed the installation and integration of the new VJ Electronix 400 Scavenger system into its Horsens, Denmark facility. BB Electronics will use the noncontact solder removal system to enhance the reliability of its rework operations of highly complex circuit boards.

BB Electronics produces a wide portfolio of very complex printed circuit board assemblies (PCBAs) for world-leading customers. The company’s portfolio ranges from prototypes and series production of satellite communication boards, video processing and measurement systems a. o. characterized by heavy BGA population and advanced multilayer PCBs. According to BB Electronics’ SMT Engineering Supervisor Dennis Pedersen, “With the new equipment, we will be able to raise the quality, speed and yield on complex rework tasks because tough and difficult manual rework processes now are automated.”

The VJ Electronix 400S is a standalone, noncontact scavenging system for the automatic removal of residual solder from a rework site. With its automated X-Y motion, the 400S is pre-programmed to traverse the component site in the fastest and most efficient fashion, resulting in the optimum heat transfer to reflow the solder while minimizing thermal exposure. Dynamic height sensing (DHS) ensures optimum solderability for the replacement of a new component.

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