Citation
(2012), "IPC International Technology Roadmap provides OEM vision of future boards and assemblies2013 roadmap activities get underway with a call for volunteers", Soldering & Surface Mount Technology, Vol. 24 No. 3. https://doi.org/10.1108/ssmt.2012.21924caa.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2012, Emerald Group Publishing Limited
IPC International Technology Roadmap provides OEM vision of future boards and assemblies2013 roadmap activities get underway with a call for volunteers
Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 24, Issue 3
The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released last month at IPC APEX EXPO® 2012. Published biennially, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative technology. The 2011 roadmap incorporates revealing data and comparisons to help users serve clients and/or guide their companies in identifying, selecting and developing the right technology alternatives to create the products needed for future markets.
The 2011 roadmap includes expanded regional analysis and comparison. In both the substrate and assembly sections, the 2011 roadmap provides insight into the regional differences in capability between Asia, Europe and North America. According to Marc Carter, IPC Director of technology transfer, the new data sheds light on the important distinction between acknowledging a technology and actually having the capability to employ it.
Another essential addition to the 2011 roadmap is the link of emulators to industry standards and specifications. A new section discusses the changes that need to occur in industry standards content to make them relevant to tomorrow’s needs. This includes the addition of a state-of-the-art level for product features that demand a higher degree of precision – a level that Carter admits very few manufacturers can provide.
In areas where changes occur with dizzying speed such as the environment, health and safety; regulations and global stewardship, the roadmap has been updated to reflect the current state as well as future issues.
As the IPC Roadmap committee embarks on the development of the 2013 roadmap, the group invites anyone interested in helping make each successive release more comprehensive to join in its efforts. For details on getting involved, contact Carter at: MarcCarter@ipc.org or +1 847-597-2826, or Jeanne Cooney, IPC manager of ANSI programs, at: JeanneCooney@ipc.org or +1 847-597-2842
Published as a CD, the roadmap includes several technical resource presentations that users can access easily at their workplace. For more information or to purchase 2011 IPC International Technology Roadmap for Electronic Interconnections, visit at: www.ipc.org/roadmap