Etek Europe invests in Parmi HS70 Solder Paste Inspection System for UK Technology Centre

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 21 June 2013

94

Citation

(2013), "Etek Europe invests in Parmi HS70 Solder Paste Inspection System for UK Technology Centre", Soldering & Surface Mount Technology, Vol. 25 No. 3. https://doi.org/10.1108/ssmt.2013.21925cab.013

Publisher

:

Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited


Etek Europe invests in Parmi HS70 Solder Paste Inspection System for UK Technology Centre

Article Type: Industry news From: Soldering & Surface Mount Technology, Volume 25, Issue 3

Etek Europe Ltd has invested in a Parmi SPI HS70 Solder Paste Inspection System for its new custom-built Technology Centre in the UK.

The HS70 Solder Paste Inspection System offers many distinct features including innovative dual lasers and z-axis board warpage management to deliver the industry’s highest measurement performance. The RSC-VI head inspects at 100 cm2/s at 13×13 μm to deliver the industry’s fastest production speed, maximum throughput and an unbeatable competitive advantage.

For more information about the Solder Paste Inspection System, visit: www.etek-europe.com and www.parmi.com.

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