Table of contents
Planar Thick Film Varistors
O.S. Aleksić, P.M. Nikolić, T.D. Grozdić, LukovićVarious thick film varistor constructions were made and characterised: ‘sandwich’, ‘interdigitated’ and ‘segmented’ varistors. The varistor active layer thickness, the electrode…
Factors in the Establishment of a Power Hybrid Manufacturing Facility
G.W. HillAs the hybrid market changes, many hybrid companies are being forced to adjust to reduced defence budgets and to the encroachment of epoxy board based SMT on traditional hybrid…
New High Yield, High Reliability Materials System for Silver Multilayer Construction
C.R. Pickering, W.A. Craig, M.F. Barker, J. Cocker, P.C. Donohue, G. VanrietveldeComplex mixed metallurgy multilayers require a very robust dielectric to withstand shorting or blistering effects, together with high density for long‐term reliability in humid…
Thick‐film Fine‐line Fabrication Techniques — Application to Front Metallisation of Solar Cells
A. Dziedzic, J. Nijs, J. SzlufcikDifferent techniques applied for the fabrication of thick‐film fine lines have been analysed. The basics, achievements, advantages and disadvantages of improved screen printing…
Education in Hybrid Microelectronics: Part 2
J. Atkinson, K. Pitt, K. WilliamsThe University of Southampton Thick‐Film Unit (TFU) was originally established in the Department of Electronics in 1985 to service the requirements of a transducer research group…
Fabrication of High Density Multi‐chip Modules with Standard IC Production Equipment
B. De Meulemeester, A. Van Calster, A. De Bruycker, K. AllaertSince the first appearance of high density interconnection systems about ten years ago, researchers have tried to exploit this concept to the full. By introducing new technologies…
Vapour Phase Soldering and Removal of Flux Residues after Soldering in the Electronics Industry: Substitution of Organic Solvents
F. Sørensen, H.J. Styhr PetersenWhen providing substitutes for CFC‐113 in processes such as vapour phase soldering and removal of flux residues after soldering in the electronics industry, it is also important…
Hybrid Substrates for Power Electronic Applications: An Investigation of Thermal Resistance and Mechanical Stress
A. Bjorneklett, L. Halbo, H. Kristiansen, L.M. Nilsen, T. Storfossene, T. TuhusA new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises…
Design Constraints for the Use of Insulated Metal Substrates®
H. FickPower electronics used in consumer product assemblies require thermal management. Several current products rely on ‘printed wiring’ designs. These have copper patterns separated…
ISHM news
Barry George, M. SomoraOn 8 October 1992 the ISHM‐Benelux Chapter organised a one‐day conference entitled ‘New Trends in Electronic Packaging and Interconnection’ which took place in the Holiday Inn…
Industry news
Dave LowrieSelf‐contained emergency lighting luminaires are mandatory in most countries for public buildings, offices and factories to ensure maximum safety in the event of a power failure…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson