Table of contents
Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill
Zhaowei ZhongReports the research and development results on flip chip on FR‐4 and ceramics, using anisotropic conductive film (ACF), anisotropic conductive paste (ACP), or eutectic solder…
Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package
Bart Vandevelde, Eric BeynePresents the thermo‐mechanical modelling of a new type of area array package: the flip chip on polymer stud grid array (PSGA). The objective is to optimise the material and…
High frequency wire bonding for PBGA package, a process optimisation approach
Teo Kiat Choon, Victor G. CorpuzIn a plastic BGA package, the glass transition temperature of 170‐215°C for bismaleimide triazine (BT) substrate puts an upper ceiling to the usable wire bond temperature. To…
HDI substrate technology for electronic automotive applications
M. Bremond, D. LambertPresents a survey of build‐up technologies based on the manufacture of microvia in thin dielectric sheets (< 100µm) deposited on PWB materials. These technologies will permit the…
A new approach to flip chip on board technology using SMT compatible processes
S. Zhang, J. De Baets, A. Van CalsterA flip chip on board technology fully compatible with current PCB facilities is reported. It used reflow soldering for chip attachment. It required electroless nickel/immersion…
The cyclic fatigue behaviour of ball grid arrays
A.J. Curley, K.J. Williams, T. Le, H. PatelThis paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface…
Low cost high performance microwave structures fabricated by advanced thick film techniques
Barbara Dziurdzia, Stanislaw Nowak, Michal Ciez, Wojciech Gregorczyk, Heiko Thust, Erich PolzerThe paper presents the application of two advanced thick‐film techniques: etching of fired thick‐films and photoimaging of photosensitive thick‐films for fabrication bandpass…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson