Table of contents
A novel approach for hybrid optoelectronic circuits: thick‐film on glass (TOG)
Achim Köhler, Peter DullenkopfThe realization of thick‐film circuits on glass substrates is discussed. Within the large number of commercially available thick‐film pastes, suitable pastes for thick‐film…
Assessing the cost‐effectiveness of integrated passives
Michael Scheffler, Gerhard Tröster, Joaquin Lopez Contreras, Jürgen Hartung, Michel MenardPassive components integrated into a high‐density substrate can be a tolerable way to overcome the size and manufacturing limits of SMD passives mounted on to the system board…
Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests
Kang Zhang, Michael PechtPlastic ball grid array (PBGA) packages are non‐hermetic surface mount packages, designed in response to market demands for cost‐effective, high I/O count, small footprint, and…
2D‐model for thermal analysis of hybrid power modules
B. Radojcoić, R. Ramović, O. AleksićA two‐dimensional model for hybrid circuits is presented in this paper. Simulation results of a hybrid power module for different power dissipation of components and ambient…
Investigation into the curing and thermal behavior of an epoxy‐based UV curable coating in microelectronics assembly
Chi Fo TsangUV curing processes of materials have to be specially designed accordingly in order to obtain the optimized property for different electronics applications. The purpose of this…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson